Wewon Environmental Chambers Co., Ltd. offers state-of-the-art liquid to liquid thermal shock chambers designed to meet the stringent demands of electronic component testing. By employing the two-fluid-bath method, These chambers provide a comprehensive and accurate assessment of component durability under extreme thermal conditions. With various model sizes and basket options, Wewon ensures that their thermal shock chambers cater to diverse testing needs, Making them a valuable asset in the electronics industry.
For manufacturers and testers looking to validate the reliability of their electronic components, Wewon’s liquid-to-liquid thermal shock chambers stand out as a robust and reliable solution, Ensuring products meet the highest quality and performance standards. Thermal shock testing is a critical procedure in evaluating the performance of electronic components under extreme temperature variations. The liquid-to-liquid thermal shock test chamber provides a unique approach by subjecting samples to rapid thermal cycling between two different liquid temperatures. This method helps simulate real-world conditions where electronic components might experience sudden temperature shifts, Thus assessing their robustness and reliability.
In the realm of electronic component testing, Ensuring the reliability and durability of products like PCB boards, IC chips, circuit boards, and semiconductor devices is paramount. One effective way to assess these components’ resilience is through thermal shock testing, Specifically utilizing the liquid-to-liquid thermal shock chamber with the two-fluid-bath method. This article delves into the features, Benefits, and applications of liquid-to-liquid thermal shock test chambers, Particularly those manufactured by Wewon Environmental Chambers Co., Ltd.
| Equipment Model | WEW-LLTC-68-2-14 | WEW-LLTC-883J-1011 | WEW-LLTC-JESD22 |
| Thermal Shock Test | Liquid-to-Liquid | Elevator Type | Two-Liquid Bath System |
| Specimen Basket | W150* H200* D250mm 2 Bath | W220* H220* D250mm 2 Bath | W260* H350* D450mm 2 Bath |
| Drive System (Transfer) | Horizontal, Air Drive System | Horizontal, Air Drive System | Horizontal, Air Drive System |
| Hot Bath Temp Range | +70℃ ~ +200℃ | +50℃ ~ +150℃ | +70℃ ~ +200℃ |
| Fluctuation Range | ± 2.0℃ | ± 2.0℃ | ± 2.0℃ |
| Temp Stable Time | 20℃ ~ 150℃ in 75 min | 50℃ ~ 150℃ in 30 min | 50℃ ~ 200℃ in 50 min |
| Cold Bath Temp Range | +10℃ ~ +25℃ | -65℃ ~ +0℃ | -65℃ ~ +0℃ |
| Fluctuation Range | ± 2.0℃ | ± 2.0℃ | ± 2.0℃ |
| Temp Stable Time | 10℃ ~ 20℃ in 15 min | -65℃ ~ 0℃ in 60 min | -65℃ ~ 0℃ in 80 min |
| Temp Stable Time | 20℃ ~ 10℃ in 30 min | RT℃ ~ -65℃ in 120 min | RT℃ ~ -65℃ in 100 min |
| Exposure Time | High, Low Temp in 5 min | High, Low Temp in 5 min | High, Low Temp in 10 min |
| Number of Cycles | 5 Cycles | 15 Cycles | 40 Cycles |
| Load Carrying Max | Plastic Molded ICs, 2.0 Kgs | Plastic Molded ICs, 1.0 Kgs | Plastic Molded ICs, 5.0 Kgs |
| Specimens Transfer Time | Hot to Cold Bath ＜ 10 Sec | Hot to Cold Bath ＜ 10 Sec | Hot to Cold Bath ＜ 10 Sec |
| Specimens Transfer Time | Cold to Hot Bath ＜ 10 Sec | Cold to Hot Bath ＜ 10 Sec | Cold to Hot Bath ＜ 10 Sec |
| Noise Leval | 65 dB or Less | 65 dB or Less | 65 dB or Less |
| Circulation System | Sirocco Fan | Sirocco Fan | Sirocco Fan |
| Controller System | Color TFT LCD 7.0 Inches | Color TFT LCD 7.0 Inches | Color TFT LCD 7.0 Inches |
| Internal Material | Stainless Stell (SUS304) | Stainless Stell (SUS304) | Stainless Stell (SUS304) |
| External Material | Cold Rolled Steel Sheet | Power Coating with Blue | Power Coating with Blue |
| Insulation Material: | Rigid Polyurethane Foam | Glass Fibre, Glass Wool | Rigid Polyurethane Foam |
| Compressor Type | Tecumseh (France), 2 Pieces | Tecumseh (France) + BOKE | Mechanical Cascade (Air-Cooled Condenser) |
| Cooling System | Air Cooling Way | Air Cooling Way | Air/Water Cooling |
| Refrigerant Mode | R404A Dupont, US | R404A, R23, R507 | R404A, R23, R507 |
| Equipment Deimensions | W2250* H1980* D1650mm | W2450* H2100* D1650mm | W2500* H2250* D1850mm |
| Safety Sepcification | (1) Control Circuit Breaker, Overheat Protection | (2) Overload Relay (Agitator, Exhaust Fan, Compressor) | (3) Leakage Breaker, Emergency Stop Switch (EMO) |
| Power Specification | AC 220V ±10%, 1φ， 50Hz | AC 380V ±10%, 3φ， 50Hz | AC 208V ±10%, 3φ， 50Hz |
| Ambient Temperature | 0℃ ~ +40℃ | 0℃ ~ +40℃ | 0℃ ~ +40℃ |
| Air-Source Supply | 4 to 7 kfg/cm2 | 4 to 7 kfg/cm2 | 0.4 Mpa to 0.7 Mpa |
| Equipment Weight | 650 KGS | 790 KGS | 850 KGS |
ACS Air-Liquid Thermal Shock Chamber｜Air to Liquid Design｜The ACS product range already includes chambers for thermal shock tests of either the air-air type or the liquid-liquid type, where the medium used to cause the thermal shock between a hot and a cold environment is the same. It’s the first time that ACS has introduced the mixed type for the realisation of a highly customised product. It has entailed the study of technical solutions different from those used in other thermal shock machines and specific to solve the problems arising from the coexistence of two environments with different fluids. Read more…
ACS Air to Air｜Liquid to Liquid Thermal Shock Chambers｜ACS has developed and is producing a full range of chambers for Liquid-to-Liquid thermal shock tests. This standard range of chambers meets any commercial or military test specification. The chamber body is gray RAL 7035, the front is blue RAL 5015. Two powerful compressors are connected in cascade and provide rapid and reliable temperature cooling performance. Environmentally friendly refrigerants are also used. The basket movement is electrically operated. The time needed by the basket to move from one well to the other is less than 10 seconds. A plexiglass cover door closes the test volume in order to minimize the liquid consumption by evaporation. Read more…
| The liquid-to-liquid thermal shock test chamber is highly effective for testing printed circuit boards (PCBs), which are crucial in almost all electronic devices. The thermal shock test ensures that PCBs can withstand extreme temperature changes without failure. | Testing PCB Boards: |
| For integrated circuits (ICs) and circuit boards, the chamber provides a rigorous test environment to ensure these components can handle thermal stresses encountered during operation. | IC Chips and Circuit Boards: |
| The liquid to liquid thermal shock test chamber manufactrured by Wewon Environmental Chambers Co., Ltd. is essential for validating the performance and reliability of semiconductor devices under harsh conditions｜Equipment for MIL-STD-883 Method 1011 | Semiconductor Devices: |
| Wewon’s liquid-to-liquid thermal shock test chambers come in three standard sizes to accommodate various testing needs: – **W150*H200*D250mm**: Suitable for smaller specimens and lightweight components. – **W220*H220*D250mm**: Designed for medium-sized samples. – **W260*H350*D450mm**: Ideal for larger or heavier components. |
Equipment Variations | Equipment Features |
| The baskets used to hold specimens during testing come in dimensions tailored to different component sizes and weights: – **2 Kilos**: Suitable for smaller, lightweight plastic molded ICs. – **5 Kilos**: Designed for medium-sized components. – **10 Kilos**: Accommodates larger or heavier samples. |
Specimen Basket Options | |
| The chambers are equipped with a robotic arm that transfers the specimen basket between the hot and cold liquid baths. This automation ensures precise and immediate temperature shock, enhancing the accuracy of the test results. | Robotic Arm Integration: | |
| The design of Wewon’s liquid-liquid type thermal shock test chambers ensures excellent temperature distribution, Providing a uniform testing environment that accurately reflects real-world conditions ｜ Equipment Photo 1 ｜ Equipment Photo 2 ｜ Equipment Photo 3 | Temperature Distribution: |
SAMWONTECH Liquid Tank Thermal Shock Test Chamber｜SAMWONTECH liquid tank thermal shock chamber used for shortening development period, used in shipment inspection of cpu board, Screening of semiconductor, durability test of print based or automobile parts (Japanese patent 3898210) It reduces liquid consumption by releasing air to the outside and recovering high temperature liquid by using vapor recovery device. The long-term continuous operation of 1000 cyces or more is available by instaling a frozen protection circuit in the low temperature tank. Available for standard test such as MIL-STD, JEDEC, IEC Read more…
10 Liters Thermal Shock Chamber｜Elevator Type｜Air-to-Air｜Have you ever encountered a 10 liters thermal shock chamber ? Recently, Wewon Environmental Chambers Co., Ltd. unveiled their latest model last week. This thermal shock test chamber is notable for its compact design, making it the smallest elevator-type thermal shock chamber currently available on the market, featuring an air-to-air cooling solution. With its diminutive size, This 10-liter thermal shock chamber is designed to maximize space efficiency in your testing area. Its sleek and modern appearance mirrors the precision and professionalism of an experienced engineer standing by, always ready to assist with your needs. Read more…
| MIL-STD-202 Method 107 | Thermal Shock | Accept Liquid-to-Liquid and Air-to-Air Method Way | Evaluates
component resistance to extreme temperature changes. Can be conducted in
calibrated air or liquid bath environmental chambers. The medium used depends on specific test conditions (e.g., Condition A, B, C) and equipment capability. |
| MIL-STD-750 Method 1056 | Thermal Shock (liquid to liquid) | Liquid-to-Liquid | MIL-STD-750
is a test method standard specifically for discrete semiconductor devices.
Within this standard framework, Method 1056 officially stands for
“Thermal shock (liquid to liquid)”. Note: Similar to JEDEC, if you need to perform air-to-air testing on semiconductor devices, you must switch to Method 1051 within the MIL-STD-750 framework, whose official name is “Temperature cycling (air to air)”. |
| MIL-STD-883E Method 1010 | Temperature Cycling | Air-to-Air | Effect: Like going from a sauna to an air-conditioned room. Slower temperature ramp-up and down.Purpose: Tests if materials will fatigue during long-term thermal expansion and contraction.Equipment: Air-to-air test systems are sufficient (e.g., ESPEC TSA series, Wewon 2 zones thermal shock chamber (lifting design) or Wewon ATS-710 temperature forcing system). |
| MIL-STD-883E Method 1011 | Thermal Shock | Liquid-to-Liquid | Effect: Like dropping a red-hot iron into ice water. Instant temperature step jump using Perfluorocarbon in cold and hot dual baths.Purpose: Triggers hidden internal micro-cracks, severe material mismatches, or packaging flaws through extreme physical stress.Equipment: Must use an expensive dual-bath Liquid-to-Liquid shock test system. Do NOT buy an air-to-air test system if Condition C is strictly required. |
